Sputtering target & bonding processing
We offer sales of sputtering targets (planar/cylindrical) and support bonding processing.
For applications such as semiconductors, MRAM, touch panels, anti-reflective films, solar cells (PV), lithium-ion batteries, and displays: - We offer a wide range of support from small-scale prototyping of sputtering targets to mass production supply. - We can provide reliable bonding solutions based on years of experience and knowledge, along with proposals tailored to your budget. - We support not only planar types but also cylindrical targets and bonding that offer cost advantages and excellent yield. - Quality assurance through our proprietary large UT inspection equipment (ultrasonic testing) and quality management system. - In addition to our own facilities, we leverage domestic and international networks to meet diverse needs. - We possess uniquely developed high-quality bonding materials and methods.
- Company：協同インターナショナル
- Price：100,000 yen-500,000 yen
